Thermco - Clean anneal furnace (MOS)

Location: 
ANFF-NSW Node
Lab 1
Process type: 
Non Material Specific - Thermal Treatment
Process summary: 

High temperature annealing (Si only), Si MOS compatible materials only, Multiple (up to 20) wafers up to 100mm diameter, Si-MOS compatible materials only. 350-500C. gases: N2, forming gas (95pc N2, 5pc H2)

Marquee: 
Yes
Operational Status: 
Operational

See ANFF-NSW Website for Further Information