Oxford RIE system

Location: 
ANFF-NSW Node
Lab 1
Process type: 
Non Material Specific - Pattern
Process summary: 

Reactive ion etching; Shallow etching of Si based materials; Process gases: O2, SF6, CF4, CHF3, Ar, CH4; Approved materials: Si, SiO2, Si3N4, Ge; Approved Masks: Photoresists, HSQ, SiO2, a-Si, Poly-Si, Chrome, Alumina, PMMA; Single wafer up to 150mm diameter; 13.56MHz 300W RF generator with auto matching unit.

Marquee: 
Yes
Operational Status: 
Operational

See ANFF-NSW Website for Further Information