Oxford PECVD tool

Location: 
ANFF-NSW Node
Lab 1
Process type: 
Non Material Specific - Deposition Thin Film
Process summary: 

Plasma Enhanced Chemical Vapour Deposition of a-Si, Si3N4, SiO2, ammonia free Si3N4, low stress Si3N4. Substrates - Semiconductors (eg. Si, GaAs ), Insulators (eg. Glass, Quartz, Sapphire). Process gases- CF4, N2O, Ar, N2, SiH4, NH3. Single wafer up to 150mm diameter 13.56MHz 300W RF generator with auto matching unit. LF generator for low stress nitride films.

Marquee: 
Yes
Operational Status: 
Operational

See ANFF-NSW Website for Further Information