Lesker PVD75 e-beam evaporator (MOS)

Location: 
ANFF-NSW Node
Lab 1
Process type: 
Non Material Specific - Deposition Thin Film
Process summary: 

Directional e-beam deposition of Si MOS compatible materials ONLY (Al, Pt, Ti, Pd); Single wafer up to 150mm diameter, Can accommodate multiple smaller chips; in-situ Ar plasma etching capability

Marquee: 
Yes
Operational Status: 
Operational

See ANFF-NSW Website for Further Information