Lesker PVD75 e-beam evaporator (general purpose)
Location:
ANFF-NSW Node
Lab 1
Process type:
Non Material Specific - Deposition Thin Film
Process summary:
Directional e-beam deposition of Au and other non-MOS materials; Au and other non-MOS compatible materials (Al, Ti, Pt, Pd, Cr, Ni, Ge, Ag, SiO2). Other materials by prior approval; Single wafer up to 150mm diameter, Can accommodate multiple smaller chips
Marquee:
Yes
Operational Status:
Operational
See ANFF-NSW Website for Further Information
