Lesker PVD75 e-beam evaporator (general purpose)

Location: 
ANFF-NSW Node
Lab 1
Process type: 
Non Material Specific - Deposition Thin Film
Process summary: 

Directional e-beam deposition of Au and other non-MOS materials; Au and other non-MOS compatible materials (Al, Ti, Pt, Pd, Cr, Ni, Ge, Ag, SiO2). Other materials by prior approval; Single wafer up to 150mm diameter, Can accommodate multiple smaller chips

Marquee: 
Yes
Operational Status: 
Operational

See ANFF-NSW Website for Further Information