Au wire chip bonding, manual or automatic bonding (single chip), recommended minimum pad size 150micron x 150micron
See ANFF-NSW Website for Further Information
Australian Centre For Advanced Photovoltaics
UNSW Sydney NSW 2052 Australia
Telephone +61 2 9385 4018 | Email acap@unsw.edu.au
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This Program has been supported by the Australian Government through the Australian Renewable Energy Agency (ARENA). The Australian Government through ARENA is supporting Australian research and development in solar photovoltaic and solar thermal technologies as part of its commitment to making renewable energy technologies more affordable and increasing the amount of renewable energy used in Australia. The views expressed herein are not necessarily the views of the Australian Government, and the Australian Government does not accept responsibility for any information or advice contained herein. |
Page last updated: Friday 24 June 2016
