K&S Al wedge bonder

Location: 
ANFF-NSW Node
Lab 1
Process type: 
Device Performance - Device Contacting
Process summary: 

Al wire chip bonding, manual bonding (single chip), 25 micron diameter Al wire; recommended minimum pad size 150micron x 150micron

Marquee: 
Yes
Operational Status: 
Operational

See ANFF-NSW Website for Further Information