Jipelec rapid thermal annealer (MOS)

Location: 
ANFF-NSW Node
Lab 1
Process type: 
Non Material Specific - Thermal Treatment
Process summary: 

Rapid Thermal Anneal, Si MOS compatible materials only, Single wafer up to 100mm diameter, 450-1100C. UHP N2 purge,

Marquee: 
Yes
Operational Status: 
Operational

See ANFF-NSW Website for Further Information