Jipelec rapid thermal annealer (MOS)
Location:
ANFF-NSW Node
Lab 1
Process type:
Non Material Specific - Thermal Treatment
Process summary:
Rapid Thermal Anneal, Si MOS compatible materials only, Single wafer up to 100mm diameter, 450-1100C. UHP N2 purge,
Marquee:
Yes
Operational Status:
Operational
See ANFF-NSW Website for Further Information