HHV sputtering system

Location: 
ANFF-NSW Node
Lab 1
Process type: 
Non Material Specific - Deposition Thin Film
Process summary: 

Non-directional sputter deposition of a range of metals (multi-target). Most substrates, approved target materials - Ti, Al, Cr, Au, Cu, TiO2, ZnO, SiO2, W, Nb, ITO, Evanohm. Other materials by prior approval. Single wafer. 600mm chamber. Five target positions. 600W rf power supply. 2kW DC power supply. heated rotary work holder (290mm diameter, to 400C), Ar, O2 and N2 processing gases, Co-sputtering available

Marquee: 
Yes
Operational Status: 
Operational

See ANFF-NSW Website for Further Information