EVG520HE Hot Embossing System

Location: 
ANFF-SA Node
Uni SA Mawson Lakes
Process type: 
Non Material Specific - Encapsulation
Process summary: 

Hot embossing (substrate bonder) for bonding, embossing and nanoimprinting applications such as thermo-compression, fusion or low temperature bonding, configured to allow hot embossing of polymers and glass

Marquee: 
Yes
Operational Status: 
Operational
EVG520HE Hot Embossing System
EVG520HE Hot Embossing System