EVG520HE Hot Embossing System
Location:
ANFF-SA Node
Uni SA Mawson Lakes
Process type:
Non Material Specific - Encapsulation
Process summary:
Hot embossing (substrate bonder) for bonding, embossing and nanoimprinting applications such as thermo-compression, fusion or low temperature bonding, configured to allow hot embossing of polymers and glass
Marquee:
Yes
Operational Status:
Operational

EVG520HE Hot Embossing System