Edwards sputtering system

Location: 
ANFF-NSW Node
Lab 1
Process type: 
Non Material Specific - Deposition Thin Film
Process summary: 

Non-directional sputter deposition of a range of metals (single target). Most substrates, Most materials - Ti target available, Au and Pt to be supplied by user. Single wafers up to 50mm diameter. Single target diameter 100mm. Gases available - O2, Ar; 10-300W rf power; 10-300W DC power

Marquee: 
Yes
Operational Status: 
Operational

See ANFF-NSW Website for Further Information