DAD3240 dicing saw

Location: 
ANFF-NSW Node
Lab 1
Process type: 
Non Material Specific - Materials Preparation
Process summary: 

Wafer dicing. Semiconductors, glass, quartz, sapphire. Single wafer up to 200mm diameter, 1.5mm max wafer thickness. Si wafers can be diced to 0.5 x 0.5 mm with kerf widths of 40-50um. For harder materials kerf widths approx 200um

Marquee: 
Yes
Operational Status: 
Operational

See ANFF-NSW Website for Further Information