CVD Corporation LPCVD Deposition System

Location: 
ANU Engineering
E-122
Process type: 
Silicon - Deposition Thin Film
Process summary: 

LPCVD SiN deposition system - 4 inch horizontal tube

Marquee: 
Yes
Operational Status: 
Operational

Low Pressure Chemical Vapor Deposition (LPCVD) is a process used for the growth of oxides, nitrides, polysilicon, SiC, TCO, Graphene, Si/SiGe epitaxial coatings as well as nanowires and many other materials. It deposits coatings with excellent purity and uniformity with good step coverage

CVD Corporation LPCVD Deposition System
CVD Corporation LPCVD Deposition System