CVD Corporation LPCVD Deposition System
Location:
ANU Engineering
E-122
Process type:
Silicon - Deposition Thin Film
Process summary:
LPCVD SiN deposition system - 4 inch horizontal tube
Marquee:
Yes
Operational Status:
Operational
Low Pressure Chemical Vapor Deposition (LPCVD) is a process used for the growth of oxides, nitrides, polysilicon, SiC, TCO, Graphene, Si/SiGe epitaxial coatings as well as nanowires and many other materials. It deposits coatings with excellent purity and uniformity with good step coverage
CVD Corporation LPCVD Deposition System
